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TSMC Ya Tabbatar da Haɓakawa don Fab ɗin Japan Na Biyu: 3nm Chip Production Saitin don 2028

A cewar rahotanni, babban mai samar da kwangiloli na duniya, TSMC, yana shirin fara samar da manyan guntu na 3-nanometer (3nm) a Japan a cikin 2028.

TSMC is a key manufacturing partner for companies including NVIDIA, AMD, and Broadcom.According to company disclosures, the second fabrication plant in Kumamoto will adopt a 3nm process, with a planned monthly capacity of 15,000 12-inch wafers.

For context, TSMC established its Japanese subsidiary, Japan Advanced Semiconductor Manufacturing (JASM), in 2021, initially backed by Sony Semiconductor Solutions.Denso and Toyota Motor Corporation later joined as minority stakeholders.

Notably, TSMC’s first fab in Japan began mass production at the end of 2024 and has progressed smoothly.Under the current plan, the second fab is scheduled to come online in 2028.

This will mark the first time Japan achieves domestic 3nm manufacturing capability.The 3nm process represents one of the most advanced semiconductor technologies, widely applied in artificial intelligence (AI), high-performance computing, and next-generation electronic devices.